INDALLOY by PARMANU DHATU NIGAM
INDALLOY 227
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Description
Indalloy 227 is a patented, lead-free solder alloy developed to replace common tin-lead eutectic solder used in electronics soldering applications. It has similar physical and mechanical properties to 63Sn 37Pb, 62Sn 36Pb 2Ag, and 60Sn 40Pb. Indalloy 227 is a Sn-In-Ag solder alloy with the following composition: 77.2% Sn, 20% In, 2.8% Ag. Indalloy 227 has the following properties: *Liquidus point of 187°C *Good reliability *High ductility *Not for use over 100°C *Density of 7.25 g/cc Indalloy 227 is ideal for miniaturized components and fine-pitch assembly. It offers first-class printing performance, robust reflow performance, and resists voiding.
Keywords
use•7.25•60Sn•63Sn•100°C•187°C•Density•voiding•77.2% Sn•INDALLOY•2.8% Ag.•62Sn 36Pb 2Ag•High ductility•Liquidus point•Ag solder alloy•similar physical•Good reliability•fine-pitch assembly•following properties•following composition•mechanical properties•lead-free solder alloy•miniaturized components•robust reflow performance•common tin-lead eutectic solder•first-class printing performance•electronics soldering applications
