INDALLOY by PARMANU DHATU NIGAM
INDALLOY 227
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Description
Indalloy 227 is a lead-free solder alloy developed to replace tin-lead eutectic solder used in electronics soldering applications. It's a patented alloy with the following composition: 76% Sn, 20% In, 3% Ag. Indalloy 227 has a liquidus point of 187°C. It's ideal for miniaturized components and fine-pitch assembly. It also offers good printing performance and robust reflow. Indalloy 227 is a nonferrous metal. It's a solder/braze alloy and a tin alloy. Indium is a versatile metal that's often used for soldering to gold, thermal applications, low-temperature solders, bonding to ceramics, hermetic and cryogenic sealing, and CTE mismatch.
Keywords
gold•187°C•3% Ag•Indium•76% Sn•hermetic•INDALLOY•ceramics•tin alloy•CTE mismatch•robust reflow•liquidus point•patented alloy•versatile metal•nonferrous metal•cryogenic sealing•solder/braze alloy•fine-pitch assembly•thermal applications•following composition•lead-free solder alloy•low-temperature solders•miniaturized components•tin-lead eutectic solder•good printing performance•electronics soldering applications
