Description

INDALLOY 205 is a solder cream or paste with a composition of 60% indium and 40% lead. It is the most commonly used indium-lead alloy. INDALLOY 205 has a liquidus temperature of 183°C, which is close to the tin-lead eutectic. It is part of a group of lead-indium solders designed to cover the temperature range of 165°C-275°C. Solder is an alloy of lead and tin. Soft solder typically has a melting point range of 90 to 450 °C (190 to 840 °F; 360 to 720 K). Alloys that melt between 180 and 190 °C (360 and 370 °F; 450 and 460 K) are the most commonly used.